On 12/14/2015 7:47 PM, Dave McGuire via vcf-midatlantic wrote:
On 12/14/2015 07:46 PM, Jonathan Gevaryahu via vcf-midatlantic wrote:
Yeah 300F was completely wrong, I was mixing baking floppies up with baking EPROMS after x-ray (not UV!) based erasure (which really does need 300F). Can you tell me more about this? Does baking somehow address the problem of surface state creation during X-ray erasure?
(I type this with a glance at a stack of trays containing several thousand non-windowed EPROM-based microcontrollers, and another glance over at my X-ray machine..) You forgot to mention your electron microscope. Can an electron beam erase EPROMs nondestructively?? I know a UV laser can, but you need to live-decap (i.e. decap without damaging the die or bond wires) the chip first. This is used by security researchers to unset security bits etc on microcontrollers. Well we know UV can. That's just targeted UV.
-Dave
I don't have access to an X-ray source here, so I've never tried it. -- Jonathan Gevaryahu jgevaryahu@gmail.com jgevaryahu@hotmail.com